Center for Electronic Packaging Materials,rnDepartment of Materials Science and Engineering, KAIST, 373-1rnGuseong-dong, Yuseong-gu, Daejeon 305-701, Republic of Korea;
rnCenter for Electronic Packaging Materials,rnDepartment of Materials Science and Engineering, KAIST, 373-1rnGuseong-dong, Yuseong-gu, Daejeon 305-701, Republic of KorearnPhone: +82-42-350-4274 Fax: +82-42-350-8841 E-mail: jinyu@kaist.ac.kr;
rnCenter for Electronic Packaging Materials,rnDepartment of Materials Science and Engineering, KAIST, 373-1rnGuseong-dong, Yuseong-gu, Daejeon 305-701, Republic of Korea;
机译:电迁移引起锡-3.5Ag / Cu焊点中的Kirkendall空隙增长
机译:通过添加少量Ge抑制Cu / Sn-3.5Ag焊点处的Cu_3Sn和Kirkendall空隙
机译:通过添加少量Ge抑制Cu / Sn-3.5Ag焊点处的Cu 3 sub> Sn和Kirkendall空隙
机译:电迁移(EM)和KIRKENDALL效应之间的耦合在SN-3.5AG / CU焊点中
机译:SNBI系统的电迁移行为:对低温焊点可靠性的影响
机译:Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应
机译:电迁移对焊点形成的影响:99.3sn-0.7Cu与96.5sn-3.0ag-0.5Cu无铅焊料的比较