Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks

摘要

Interlayer cooling is the only heat removal concept which scales with the number of active tiers in a vertically integrated chip stack. In this work, we numerically and experimentally characterize the performance of a three tier chip stack with a footprint of 1cm². The implementation of 100µm pitch area array interconnect compatible heat transfer structures results in a maximal junction temperature increase of 54.7K at 1bar pressure drop with water as coolant for 250W/cm² hot-spot and 50W/cm² background heat flux. The total power removed was 390W which corresponds to a 3.9kW/cm³ volumetric heat flow.