首页> 外文会议>33rd European Solid-State Device Research Conference (ESSDERC 2003); Sep 16-18, 2003; Estoril, Portugal >Investigation of electron and hole mobilities in MOSFETs with TiN/HfO2/SiO2 gate stack
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Investigation of electron and hole mobilities in MOSFETs with TiN/HfO2/SiO2 gate stack

机译:具有TiN / HfO2 / SiO2栅堆叠的MOSFET中电子和空穴迁移率的研究

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摘要

In this work, the effective mobility of HfO_2 n and pMOSFETs has been investigated using low temperature measurements and constant voltage stress. It was found that Coulomb scattering mechanism has significant influence on mobility degradation. A correlation between trapped charge and mobility degradation has been made, that could explain the difference observed in nMOS and pMOS mobility behavior compared to SiO_2.
机译:在这项工作中,已经使用低温测量和恒定电压应力研究了HfO_2 n和pMOSFET的有效迁移率。发现库仑散射机制对迁移率降低具有显着影响。捕获的电荷与迁移率降低之间存在相关性,这可以解释与SiO_2相比在nMOS和pMOS迁移率行为中观察到的差异。

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