首页> 外文会议>33rd European Solid-State Device Research Conference (ESSDERC 2003); Sep 16-18, 2003; Estoril, Portugal >High Performance 50nm T-Gate In_(0.52)Al_(0.48)As/In_(0.53)Ga_(0.47)As Metamorphic High Electron Mobility Transistors
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High Performance 50nm T-Gate In_(0.52)Al_(0.48)As/In_(0.53)Ga_(0.47)As Metamorphic High Electron Mobility Transistors

机译:高性能50nm T型栅极In_(0.52)Al_(0.48)As / In_(0.53)Ga_(0.47)As变质高电子迁移率晶体管

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摘要

We report the performance of 50 nm gate length metamorphic GaAs HEMTs with maximum transconductancc(g_m) of 1520 mS/mm and current cut-off frequency(f_T) of 350 GHz, to our knowledge the highest g_m and f_T of a GaAs-based HEMT transistor. The devices were fabricated with a novel UVIII/PMMA T-gate resist stack and a non-selective "digital" wet etch gate recess technology which results in a highly uniform, high yield sub-100 nm HEMT technology.
机译:我们报告了50 nm栅长变质GaAs HEMT的性能,最大跨导cc(g_m)为1520 mS / mm,电流截止频率(f_T)为350 GHz,据我们所知,这是基于GaAs的HEMT的最高g_m和f_T晶体管。器件是用新型UVIII / PMMA T栅抗蚀剂叠层和非选择性“数字”湿法蚀刻栅凹槽技术制造的,该技术可实现高度均匀,高产量的100 nm以下HEMT技术。

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