首页> 外文会议>24th Annual BACUS Symposium on Photomask Technology pt.2 >Characterization of Defect Detection Sensitivity in Inspection of Mask Substrates and Blanks for Extreme Ultraviolet Lithography
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Characterization of Defect Detection Sensitivity in Inspection of Mask Substrates and Blanks for Extreme Ultraviolet Lithography

机译:极紫外光刻技术中掩模基板和空白检测中缺陷检测灵敏度的表征

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摘要

Defect detection sensitivity of a multi-beam confocal inspection system operating at a wavelength of 488 nm is characterized using experiments and image modeling. Experimental data on defect sensitivity are reported for programmed defects on mask substrates and blanks that are being developed for extreme ultraviolet lithography. The effects of sample surface roughness on the detection sensitivity and signal-to-noise levels are quantified. Theoretical analysis of confocal imaging of defects is in excellent agreement with measured defect images. Modeling is used to predict inspection sensitivity for defects commonly found on mask blanks.
机译:使用实验和图像建模来表征在488 nm波长下运行的多光束共聚焦检测系统的缺陷检测灵敏度。报告了关于缺陷敏感性的实验数据,这些数据是针对正在开发用于极端紫外光刻的掩模基板和坯料上的编程缺陷而设计的。量化了样品表面粗糙度对检测灵敏度和信噪比水平的影响。共聚焦缺陷成像的理论分析与测量的缺陷图像非常吻合。建模用于预测通常在掩模坯料上发现的缺陷的检查灵敏度。

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