Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, P.R. China;
Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, P.R. China;
Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, P.R. China;
Bonding; Micromechanical devices; Silicon; Packaging; Integrated circuit interconnections; Substrates;
机译:Aerosol Jet技术在MEMS晶圆级封装的直通互连中的应用
机译:基于混合键合和硅通孔的晶圆级封装和直接互连技术
机译:基于金属粘合的密封晶片级MEMS包装技术,采用平面内馈通:厚金膜馈通的密闭性和高频特性
机译:用于MEMS晶片级包装的AU-Si共晶键合的TSV垂直互连技术
机译:设计,制造和测试用于RF MEMS器件的保形,局部晶圆级封装。
机译:基于晶圆级MEMS真空封装的具有全玻璃电互连的高Q共振压力微传感器
机译:长期可靠性,烧伤和分析Au-Si共晶晶片级真空包装