首页> 外文会议>2018 IEEE/MTT-S International Microwave Symposium >Investigation of Fast and Slow Charge Trapping Mechanisms of GaN/A1GaN HEMTs through Pulsed I-V Measurements and the Associated New Trap Model
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Investigation of Fast and Slow Charge Trapping Mechanisms of GaN/A1GaN HEMTs through Pulsed I-V Measurements and the Associated New Trap Model

机译:通过脉冲I-V测量和相关的新陷阱模型研究GaN / A1GaN HEMT的快慢电荷陷阱机制

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摘要

This paper presents a new approach to characterize and model charge trapping effects of GaN-based high electron mobility transistors (HEMTs). Two types of deep-level traps (slow-emitting and fast-emitting traps) have been characterized apart by performing dedicated pulsed I-V measurements. Slow-emitting traps have been found triggered by threshold voltages (gate-source and gate-drain) and filled through reverse gate current. The slow-traps filling mechanism is modeled based upon a metal to channel trap assisted tunneling (TAT) physical process. Moreover, the TAT model parameters are extracted from gate-source and gate-drain leakage current measurements. However, the well known fast-emitting traps are classically RC-like modeled. Furthermore, this new full CAD compatible model is validated on a 4 GHz load-pull measurement.
机译:本文提出了一种新的方法来表征和建模基于GaN的高电子迁移率晶体管(HEMT)的电荷陷阱效应。通过执行专用的脉冲式I-V测量,可以区分两种深层陷阱(慢发射陷阱和快发射陷阱)。已经发现缓慢发射的陷阱由阈值电压(栅极-源极和栅极-漏极)触发,并通过反向栅极电流填充。慢阱陷阱填充机制是基于金属到沟道陷阱辅助隧穿(TAT)物理过程建模的。此外,TAT模型参数是从栅极-源极和栅极-漏极泄漏电流测量中提取的。但是,众所周知的快速发射陷阱是经典的RC类模型。此外,这种新的完全兼容CAD的模型已在4 GHz负载拉力测量中得到验证。

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