首页> 外文会议>2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits >A Study on Effect of Top and Bottom Metal Plates on Stress Induced Voiding of Nose Type Single Via Structure
【24h】

A Study on Effect of Top and Bottom Metal Plates on Stress Induced Voiding of Nose Type Single Via Structure

机译:顶部和底部金属板对鼻型单通孔结构应力诱导空化的影响研究

获取原文
获取原文并翻译 | 示例

摘要

Stress Induced Voiding of a nose type Single Via is studied. Typical nose type single via stress voiding structure has top and bottom wide metal plates originating from the pads and tapering to a narrow metal line connected by single via enabling the Kelvin type of measurements. In this paper, effect of removal of either of the top or bottom metal plates on the formation of stress induced voids at an elevated temperature is studied and results are characterized. It is found from the study that presence of bottom metal plates is vital for the void accumulation resulting in stress voiding failure.
机译:研究了鼻型单孔的应力诱导空洞。典型的鼻型单通孔应力消除结构具有顶部和底部的宽金属板,该金属板源自焊盘,并逐渐变细到通过单通孔连接的窄金属线,从而实现开尔文类型的测量。在本文中,研究了在高温下去除顶部或底部金属板对应力引起的空隙形成的影响,并对结果进行了表征。从研究中发现,底部金属板的存在对于导致应力空化失败的空洞积累至关重要。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号