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An analysis on retention error behavior and power consumption of recent DDR4 DRAMs

机译:最新DDR4 DRAM的保留错误行为和功耗分析

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DRAM technology is scaling aggressively that results in high leakage power, worse data retention time behavior, and large process variations. Due to these process variations, vendors provide large guard bands on various DRAM currents and timing specifications that are over pessimistic. Detailed knowledge on the DRAM retention behavior and currents for the average case allow to improve memory system performance and energy efficiency of specific applications by moving away from worst case behavior. In this paper, we present an advanced measurement platform to investigate off-the-shelf DDR4 DRAMs' retention behavior, and to precisely measure various DRAM currents (IDDs and IPPs) at a wide range of operating temperatures. Error Checking and Correction (ECC) schemes are popular in correcting randomly scattered single bit errors. Since retention failures also occur randomly, ECCs can be used to improve DRAM retention behavior. Therefore, for the first time, we show the influence of ECC on the retention behavior of recent DDR4 DRAMs, and how it varies across various DRAM architectures considering detailed structure of the DRAM (true-cell devices/mixed-cell devices).
机译:DRAM技术正在大规模扩展,从而导致高泄漏功率,更差的数据保留时间行为以及较大的工艺变化。由于这些过程的变化,供应商在各种DRAM电流和时序规范方面提供了过大的悲观保护带。有关DRAM保留行为和一般情况下电流的详细知识,可以避免最坏情况下的行为,从而提高特定应用程序的存储系统性能和能效。在本文中,我们提供了一个先进的测量平台,以研究现成的DDR4 DRAM的保留行为,并在广泛的工作温度范围内精确测量各种DRAM电流(IDD和IPP)。纠错和纠错(ECC)方案在纠正随机分散的单个位错误中很流行。由于保留失败也会随机发生,因此可以使用ECC来改善DRAM保留行为。因此,我们首次展示了ECC对最近DDR4 DRAM的保留行为的影响,以及考虑到DRAM(真单元设备/混合单元设备)的详细结构后,它在各种DRAM体系结构之间如何变化。

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