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An analysis on retention error behavior and power consumption of recent DDR4 DRAMs

机译:近期DDR4 DRAM的保留误差行为和功耗分析

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DRAM technology is scaling aggressively that results in high leakage power, worse data retention time behavior, and large process variations. Due to these process variations, vendors provide large guard bands on various DRAM currents and timing specifications that are over pessimistic. Detailed knowledge on the DRAM retention behavior and currents for the average case allow to improve memory system performance and energy efficiency of specific applications by moving away from worst case behavior. In this paper, we present an advanced measurement platform to investigate off-the-shelf DDR4 DRAMs' retention behavior, and to precisely measure various DRAM currents (IDDs and IPPs) at a wide range of operating temperatures. Error Checking and Correction (ECC) schemes are popular in correcting randomly scattered single bit errors. Since retention failures also occur randomly, ECCs can be used to improve DRAM retention behavior. Therefore, for the first time, we show the influence of ECC on the retention behavior of recent DDR4 DRAMs, and how it varies across various DRAM architectures considering detailed structure of the DRAM (true-cell devices/mixed-cell devices).
机译:DRAM技术正在积极扩展,导致高泄漏功率,更糟糕的数据保留时间行为以及大的过程变化。由于这些过程变化,供应商在悲观上提供各种DRAM电流和时序规格的大型防护频带。关于DRAM保留行为和电流的详细知识,允许通过远离最坏的情况行为来提高特定应用程序的内存系统性能和能量效率。在本文中,我们提出了一个高级测量平台,以调查现成的DDR4 DRAMS的保留行为,并在各种操作温度下精确测量各种DRAM电流(IDDS和IPP)。错误检查和校正(ECC)方案在校正随机分散的单位错误时是流行的。由于静脉保留失败也随机发生,因此ECC可用于改善DRAM保留行为。因此,我们首次展示了ECC对近期DDR4 DRAM的保留行为的影响,以及考虑DRAM的详细结构(真单元设备/混合单元设备)的各种DRAM架构中的各种DRAM架构的影响。

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