State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China;
Hisilicon Optoelectronics Co., Ltd, Wuhan, 430073, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China;
Department of Materials Science and Engineering, KAIST, Daejoen, 305-701, Korea;
Silver; Copper; Conductive adhesives; Powders; Resins; Curing; Oxidation;
机译:填充碳基颗粒填料的热导电环氧粘合剂复合材料:比较研究
机译:胺功能化石墨烯填充环氧树脂薄膜纳米复合材料的制备及性能
机译:基于环氧基粘合剂,填充有薄片Ag涂覆的铜作为导电填料
机译:用多组分填料填充用于绿色包装的导电粘合剂的制备及性能研究
机译:填充有导电填料混合物的聚合物共混物的性能。
机译:三维石墨烯/纳米填料(Al2O3BN或TiO2)树脂的结构设计及其在导电胶中的应用
机译:导电颗粒填充橡胶复合材料的性能研究TS1892。 A636 2008 frb。