An electrically conductive adhesive was prepared with modified epoxy resin as the matrix and flake silver powders as the conductive filler,and it was cured with the composite amine curing agent.The conductive adhesive has characteristics of low volume resistivity (1 × 10-5 Ω · cm).It is mainly used to bond the electronic components,such as awaveguide,for which the thermal deformation will occur during increasing the temperature.And the adhesive also can be used for the bonding and repairing of other electronic components.%以改性环氧树脂为基体,片状银粉为导电填料制备导电胶,并采用胺类复合固化体系实现导电胶的固化.该导电胶具有体积电阻率低(可达10-5 Ω·cm),易配制等特点.主要对存在加温变形问题的电子元器件(如波导管)进行粘接,亦可应用于其他电子元器件的粘接与修复.
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