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Innovative bipolar-CMOS integration for RF communication circuits with low-cost high-performance horizontal current bipolar transistor (HCBT)

机译:具有低成本高性能水平电流双极晶体管(HCBT)的RF通信电路的创新双极CMOS集成

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摘要

The Horizontal Current Bipolar Transistor (HCBT) technology, as an innovative concept of bipolar-CMOS integration, is presented. This low-cost integration, achieved by using only 2 or 3 additional lithography masks, allows the fabrication of HCBTs with high-performance characteristics (i.e., fT = 51 GHz, fmax = 61 GHz, BVCEO = 3.4 V). The HCBT reliability analysis based on stress tests usage, as a part of technology optimization, is presented. Several RF communication circuits in HCBT technology are designed and fabricated. The downconversion active mixer exhibits high-linearity performance (IIP3 > 25 dBm and CG > 4 dB) comparable to commercial mixers. The static divide-by-2 divider has maximum operation frequency higher than 11 GHz with only 39 mW of power consumption. The voltage-controlled oscillator with central frequency of 2.41 GHz and tuning range of 235 MHz, as an example of fully-integrated RF circuit, is demonstrated.
机译:介绍了水平电流双极晶体管(HCBT)技术,作为双极CMOS集成的创新概念。通过仅使用2个或3个额外的光刻掩模即可实现这种低成本集成,从而可以制造出具有高性能特征(即f T = 51 GHz,f max = 61 GHz,BV CEO = 3.4 V)。作为技术优化的一部分,介绍了基于压力测试用法的HCBT可靠性分析。设计并制造了HCBT技术中的几个RF通信电路。下变频有源混频器具有与商用混频器相当的高线性度性能(IIP3> 25 dBm和CG> 4 dB)。静态2分频器的最大工作频率高于11 GHz,功耗仅为39 mW。以完全集成的RF电路为例,演示了中心频率为2.41 GHz,调谐范围为235 MHz的压控振荡器。

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