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A low-cost horizontal current bipolar transistor (HCBT) technology for the BiCMOS integration with FinFETs

机译:用于BiCMOS与FinFET集成的低成本水平电流双极晶体管(HCBT)技术

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摘要

A novel Horizontal Current Bipolar Transistor (HCBT) is processed with the scaled down dimensions and the improved technology. The active transistor region is built in the defect-free sidewall of the 580 nm wide n-hills in the (110) wafer, implying the reduction of the parasitic region's volume, i.e. the extrinsic base and the collector. The fabricated HCBT exhibits the cutoff frequency (f_T) of 21.4 GHz, the maximum frequency of oscillations (f_(max)) of 32.6 GHz and the collector-emitter breakdown voltage (BV_(CEO)) of 5.6 V, which are the highest f_T and the highest f_TBV_(CEO) product among the lateral bipolar transistors (LBTs).
机译:利用缩小的尺寸和改进的技术对新型水平电流双极晶体管(HCBT)进行了处理。有源晶体管区建在(110)晶片中580 nm宽n峰的无缺陷侧壁中,这意味着减小了寄生区的体积,即非本征基极和集电极。制成的HCBT的截止频率(f_T)为21.4 GHz,最大振荡频率(f_(max))为32.6 GHz,集电极-发射极击穿电压(BV_(CEO))为5.6 V,是最高的f_T在横向双极晶体管(LBT)中,f_TBV_(CEO)的乘积最高。

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