Qualification and application of pressure-less sinter silver epoxy

摘要

Semiconductor industry is getting momentum to use pressure sinter silver to replace solder on high power application due to need to replace the lead in the solder. But pressure sinter silver epoxy requires heavy investment on the pressure molding and oven cure equipment. The existing pressure sinter silver is also need to dedicated to identified package type and this will causing the package flexibility concern. So, we would like to explore the pressure-less sinter silver epoxy. There are already many paper presented by the semiconductor industry and research centre and still a lots of work need to done in order to qualify this pressure-less sinter silver epoxy. In this paper, we will discuss the collaboration work between supplier and customer to qualify this pressure-less sinter silver epoxy. Now we are understand the behavior of this pressure-less sinter silver epoxy and can predict the application to suit this epoxy.