Classification of MID-prototypes

摘要

The technology Molded Interconnect Device (MID) offers high potential for the development of innovative product solutions. The integration of electronic and mechanical functions on spatial circuit boards allows the realization of modules with high functional density, freedom of design and a significant degree of miniaturization. However, due to the interdisciplinary nature of the technology the potentials are faced with barriers. These include mechanical, thermal and electrical interactions as well as restrictions between the product design and the production process. Therefore as a support during product development phases functional MID prototypes are necessary for the design of innovative MID-products. Prototypes are an efficient aid to support the product development. They assist the communication between the project partners and limit possible margin of errors at an early stage. Their usage helps to reduce modification costs in later dates. This is even more important since in the early stages the largest share of production cost is determined. A standardized guideline for the development of MID-prototypes does not exist yet. Many developers use established practices from related technologies (e.g. printed circuit technology). Unfortunately, this only addresses partial aspects (e.g. interconnect distances). The entire complexity of the MID technology, including interactions and restrictions, is not considered sufficiently. This paper describes a classification for MID-prototypes distinguishing in model- and processcomplexity. General and industry specific prototype-classes have been derived considering ideal manufacturing procedures for each.