Dept. of Mech. Eng., Chung Yuan Christian Univ., Chungli, Taiwan;
elastic moduli; finite element analysis; grinding; integrated circuit interconnections; integrated circuit reliability; microassembling; moulding; parameter estimation; stress-strain relations; thermal stresses; three-dimensional integrated circuits; wafer level packaging; 3D-ICs integrations; 3D-ICs package interconnects; elastic modulus; fine-pitch TSV geometry; heterogeneous functions; induced stress-strain parametric estimations; microbump; molding compound assistance; nonlinear finite element analysis; pre-stuf;
机译:使用预填充成型材料提高3D-ICs包装的组装可靠性
机译:具有超薄芯片堆叠的三维集成电路集成的组装技术开发和故障分析
机译:集成了激光芯片转移和磁性自组装功能,可实现超薄芯片放置
机译:通过模塑化合物的帮助,在3D-ICS集成中的超薄芯片组装模块的可靠性增强
机译:无铅倒装芯片的组装和可靠性。
机译:晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
机译:晶圆级底部填充对热循环试验中超薄芯片堆叠式3D-IC组件微型泵可靠性的影响
机译:使用HasT和装配测试芯片评估高可靠性应用的塑料装配工艺