首页> 外文会议>2013 IEEE International Multi Conference on Automation, Computing, Control, Communication and Compressed Sensing >A simulation-based study of gate misalignment effects in triple-material double-gate (TMDG) MOSFETs
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A simulation-based study of gate misalignment effects in triple-material double-gate (TMDG) MOSFETs

机译:基于模拟的三材料双栅极(TMDG)MOSFET栅极失准效应的研究

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摘要

In this work, a simulation based study of gate misalignment effects in triple-material double-gate (TMDG) MOSFETs is presented. An attempt is made to analyze the effects of gate misalignment on the front and back gates surface potential considering the misalignment for both the source and drain side. The surface potential profile for misaligned gate TMDG MOSFET is compared with its double and single material counterparts to predict the electrical parameters like threshold voltage roll-off. The surface potential profile is obtained through 2-D simulations by ATLAS™ from Silvaco Inc.
机译:在这项工作中,提出了一种基于仿真的三材料双栅极(TMDG)MOSFET中栅极失准效应的研究。考虑到源极侧和漏极侧的不对准,尝试分析栅极不对准对前栅极和后栅极表面电势的影响。将未对准的栅极TMDG MOSFET的表面电势曲线与其双材料和单材料对应物进行比较,以预测电参数,例如阈值电压下降。表面电势曲线是通过Silvaco Inc.的ATLAS™通过2D模拟获得的。

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