Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer

摘要

High-density electrical microbumps (25 μm diameter and 50 μm pitch) and fluidic microbumps are important to support high-bandwidth signaling, power delivery and microfluidic cooling of highperformance high-power chips in 3DICs and silicon interposer. Simultaneous fabrication of electrical and fluidic microbumps is demonstrated in this paper. Test vehicles are also fabricated for assembly. Four-point resistance measurements and preliminary fluidic testing demonstrate assembly results.