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A 22.4 dBm Two-Way Wilkinson Power-Combined Q-Band SiGe Class-E Power Amplifier with 23 Peak PAE

机译:具有2%峰值PAE的22.4 dBm两路Wilkinson功率组合Q波段SiGe E类功率放大器

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A Q-band two-stage Class-E power amplifier is designed and fabricated in a 0.13 μm SiGe HBT BiCMOS process. A low-loss wide-band two-way Wilkinson power combiner is used for on-chip power dividing and combining at the input and output of the design. A mm-wave layout-aware class-E design procedure has been followed to enable efficient switching mode operation of the power amplifier in the Q-band. Stabilization networks and subharmonic terminations have been included to prevent the occurrence of unwanted impact ionization-induced negative base current and even/odd mode oscillation in the power-combined design. The fabricated chip shows a measured performance of 22.4 dBm output power at 23% peak power added efficiency (PAE), and 9 dB power gain across 4 GHz centered around 45 GHz for a supply voltage of 2.5 V. The total chip area including the pads is 1.1 mm x 2.2 mm.
机译:采用0.13μmSiGe HBT BiCMOS工艺设计和制造Q波段两级E类功率放大器。低损耗宽带两路Wilkinson功率组合器用于设计输入和输出的片上功率分配和组合。遵循毫米波感知布局E类设计程序,可实现Q波段功率放大器的高效开关模式操作。包括了稳定网络和次谐波终端,以防止在功率组合设计中发生不希望的碰撞电离引起的负基极电流和偶/奇模振荡。制成的芯片在23%的峰值功率附加效率(PAE)下显示了22.4 dBm的输出功率性能,在2.5 GHz的电源电压下,以45 GHz为中心,在4 GHz范围内有9 dB的功率增益。包括焊盘在内的芯片总面积是1.1毫米x 2.2毫米。

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