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Gain-assisted hybrid silicon microring electro-absorption modulators

机译:增益辅助混合硅微环电吸收调制器

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摘要

Energy consumption and device footprint are major limiting factors in scaling current optical interconnect architectures to reach multi-terabit per second data transmission [1]. Hybrid integration of III–V on Si using a low-temperature O2 plasma-assisted wafer bonding technique [2] is an attractive platform for integrating active elements on Si in a low optical loss and high density manner. Further scaling on individual devices could enable hybrid photonic integrated circuits with complex functionality and low power consumption. A microring resonator is widely regarded as an ideal structure for very compact passive and active devices, e.g., recently demonstrated hybrid Si microring lasers [3]. Although microring structures are wavelength sensitive, they have several advantages viz. small size, resonance-enhanced efficiency and no intrinsic reflections. We propose a novel microring modulator design by incorporating a gain and a loss section in the same microring cavity. Separately biasing the two sections best uses the properties of a microring resonator. We compare this design with two other techniques that were previously employed on III–V-based electro-absorption (EA) microring modulators [4–5]. We also show the promise of the design in achieving high efficiency modulation with respect to some state of the art Si ring modulator results.
机译:能耗和设备占用空间是缩放当前光互连架构以达到每秒数兆兆位数据传输的主要限制因素[1]。利用低温O2等离子体辅助晶圆键合技术将III–V混合集成到硅上,是一种以低光损耗和高密度方式将有源元素集成在Si上的有吸引力的平台。在单个设备上的进一步扩展可以使混合光子集成电路具有复杂的功能和低功耗。微环谐振器被广泛认为是非常紧凑的无源和有源器件的理想结构,例如,最近展示的混合Si微环激光器[3]。尽管微环结构对波长敏感,但是它们具有几个优点。体积小,共振增强效率且无内在反射。通过在同一微环腔中合并增益和损耗部分,我们提出了一种新颖的微环调制器设计。分别偏置两个部分可以最好地利用微环谐振器的特性。我们将这种设计与以前在基于III–V的电吸收(EA)微环调制器上采用的其他两种技术进行比较[4-5]。我们还展示了该设计在实现有关某些现有技术的Si环调制器结果的高效调制方面的希望。

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