首页> 外文会议>2012 IEEE 4th Colombian Workshop on Circuits and Systems. >Modelamiento del comportamiento t#x00E8;rmico de sistemas VLSI. Modeling of thermal behavior of VLSI systems
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Modelamiento del comportamiento t#x00E8;rmico de sistemas VLSI. Modeling of thermal behavior of VLSI systems

机译:VLSI系统的热行为建模。 VLSI系统热行为建模

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This paper presents mathematical modelling and simulation of the thermal behavior in VLSI (Very Large Scale Integration) circuits. The mathematical model is based on the formulation of Heat Transfer equation and is discretized by finite difference method. The algorithm developed in Matlab® implements a computational model of a thermal transfer on substrate of VLSI circuit with arbitrary function and dimensions. Results are presented in a series of 3D images for different times of VLSI circuit. 3D images show temperature in z axis, dimensions in (x, y) axis and 2D images show temperature in color scale, dimensions in (x, y) axis. Last, this work present a relation between real time of simulation and the equivalent time of circuit's work.
机译:本文介绍了VLSI(超大规模集成电路)电路中热行为的数学建模和仿真。该数学模型基于传热方程的公式化,并通过有限差分法离散化。 Matlab®开发的算法实现了具有任意功能和尺寸的VLSI电路基板上热传递的计算模型。结果以一系列不同时间的VLSI电路的3D图像呈现。 3D图像在z轴上显示温度,在(x,y)轴上显示尺寸,而2D图像在色标上显示温度,在(x,y)轴上显示尺寸。最后,这项工作提出了仿真的实时性与电路工作的等效时间之间的关系。

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