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High frequency noise potentialities of reported CMOS 65 nm SOI technology on flexible substrate

机译:报道的CMOS 65 nm SOI技术在柔性基板上的高频噪声潜能

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In this paper, high frequency (HF) noise performance of 65nm SOI n-MOSFETs, initially fabricated on rigid substrate and subsequently reported on flexible substrate (plastic), is presented for the first time. AC and noise performance is extracted from S-parameters measurements performed up to 110 GHz and noise measurements in 6–40 GHz frequency range, respectively. Almost no degradation has been observed between the S parameters measured on SOI rigid 65 nm transistors (referred as Rigid SOI-MOS) and the same thinned transistors transfer-bonded on a flexible substrate (referred to as Flex SOI-MOS). For Flex SOI-MOS, a minimum noise figure (NFmin) as low as 1.1 dB is achieved at 20 GHz, along with an associated gain (Ga) of 14.5 dB, when the transistor is biased at Vds=1.2V and Ids=270 mA/mm: so far, this performance constitutes the best reported one for flexible electronics.
机译:本文首次介绍了65nm SOI n-MOSFET的高频(HF)噪声性能,该噪声最初在刚性基板上制造,然后在柔性基板(塑料)上报道。分别从高达110 GHz的S参数测量和6–40 GHz频率范围内的噪声测量中提取出AC和噪声性能。在SOI刚性65 nm晶体管(称为“刚性SOI-MOS”)上测量的S参数与在柔性基板(称为“ Flex SOI-MOS”)上转移键合的相同的变薄晶体管之间,几乎没有观察到退化。对于Flex SOI-MOS,在20 GHz时可实现低至1.1 dB的最小噪声系数(NF min ),以及14.5的相关增益(G a )。分贝,当晶体管偏置在V ds = 1.2V和I ds = 270 mA / mm时:到目前为止,这一性能构成了柔性电子产品中报道得最好的一种。

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