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A 65-nm High-Frequency Low-Noise CMOS-Based RF SoC Technology

机译:基于65nm高频低噪声CMOS的RF SoC技术

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摘要

The radio-frequency (RF) performance of a 65-nm RF technology is assessed. The RF CMOS was fabricated with a physical gate length of 60 nm. In addition to the deep-n-well and p+-guard-ring isolation, a multi-poly-finger layout and fabrication process is optimized to improve the CMOS device RF performance. A superior cutoff frequency fT of 250 GHz and a maximum oscillation frequency f max of 220 GHz for the n-MOSFETs (NMOS) have been achieved. The minimum noise figures ( NF min's) are around 0.2 and 0.3 dB at 2.4 and 5.8 GHz, respectively. n+-well accumulation-mode MOS varactors, inductors, and metal-oxide-metal (MOM) capacitors are integrated with CMOS devices in a single chip by a standard logic process without extra masks. The tuning ratio of the varactor can be up to 12 with a peak quality (Q) factor of 20. The polysilicon-patterned ground shield and 3.7-¿m-thick Cu metal process are implemented to improve the Q factor of the inductors. The structure and performance of the MOM and metal-insulator-metal capacitors are benchmarked, and a mesh structure is proposed to reduce the mismatch of the MOM capacitors.
机译:评估了65纳米RF技术的射频(RF)性能。 RF CMOS的物理栅极长度为60 nm。除了深n阱和p +保护环隔离之外,还优化了多指布局和制造工艺,以提高CMOS器件的RF性能。对于n-MOSFET(NMOS),已经实现了250 GHz的出色截止频率fT和220 GHz的最大振荡频率f max。在2.4 GHz和5.8 GHz时,最小噪声系数(NF min)分别约为0.2 dB和0.3 dB。 n + / n阱累积模式MOS变容二极管,电感器和金属氧化物金属(MOM)电容器通过标准逻辑工艺与CMOS器件集成在单个芯片中,无需额外的掩模。变容二极管的调谐比可以达到12,峰值质量(Q)因子为20。采用多晶硅图形接地屏蔽和3.7 µm厚的铜金属工艺可改善电感的Q因子。对MOM和金属-绝缘体-金属电容器的结构和性能进行了基准测试,并提出了一种网状结构以减少MOM电容器的失配。

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