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Manufacture of novel double-side direct thru kit with nonexchange layer structure base on general PCB process

机译:基于通用PCB工艺制造具有非交换层结构的新型双面直通套件

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摘要

In this paper, the novel double-side direct thru kit with non-exchange layer structure is presented. The thru element of open-short-load-thru (SOLT) had been realized base on co-planar waveguide structure by the proposed manufacture flow. The results of thru element are measured by Cascade ACP type RF probe in 3D double-side measurement system. The operating bandwidth is 13.7 GHz with upon −0.2dB forward insertion loss and below −20dB return loss.
机译:本文提出了一种具有非交换层结构的新型双面直通套件。通过提出的制造流程,在共面波导结构的基础上实现了开-短负荷-直通(SOLT)直通元件。通过元件的结果通过3D双面测量系统中的Cascade ACP型RF探头进行测量。工作带宽为13.7 GHz,前向插入损耗为-0.2dB,回波损耗低于-20dB。

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