Correlation Factor Analysis of FEA Model Simplification Methods of Printed Circuit Board

摘要

Aiming at the failures of aviation electronic equipments which experienced vibration load, the simulation on vibration characteristic of the printed circuit board is presented using the finite element analysis software ANSYS-Workbench. Various input factors that may have correlation with the modal frequencies and mode shapes of the PCB are studied by the illustration of an avionics printed circuit board. The contrast study mainly focus on the PCB material parameters, meshing conditions, different model reduction methods and means of contact constraints. The principles of simplifying FEA model are acquired through the sensitivity analysis of various factors on the frequency error. The experience on of electronic products is accumulated, and the accuracy of failure prediction is ensured by using the results of vibration response.