Error e.g. assembly error, locating method for printed circuit board, involves obtaining test parameters from correlation analysis of signal subjected in circuit and signal measured at circuit

摘要

The method involves measuring test parameters of a circuit of a printed circuit board (15) that is equipped with components. The measured test parameters are compared with reference parameters. The test parameters are obtained from a correlation analysis of a signal subjected in the circuit and a signal measured at the circuit, where either the subjected signal or the measured signal is directly coupled into the board and/or decoupled from the board. Other signals are decoupled from the board and/or coupled in the board over a capacitive coupling. An independent claim is also included for a device for locating errors on an electronic printed circuit board.