School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China;
School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China;
ASE Assembly Test (Shanghai) Limited, 669 Guoshoujing Road, Shanghai, 201203, China;
ASE Assembly Test (Shanghai) Limited, 669 Guoshoujing Road, Shanghai, 201203, China;
School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China;
机译:铜键合线的再结晶,电熄火特性和电子背散射衍射
机译:基座温度对5N铜线焊接的结合强度和变形特性的影响
机译:连续退火过程中铜焊丝的组织演变和力学性能
机译:预镀引线框架上铜线键合的退火效果和结晶特性
机译:电子封装的预镀引线框架中的材料科学。
机译:(13-dimesityl-1H-imidazol-3-ium-2-yl)methanolato铜(II)氯化物二聚体的晶体结构:甲醛插入铜-碳烯键中
机译:铜和金键合线退火过程中的微观组织演变
机译:稀铜合金真空退火和内氧化单晶的超声衰减