Study on Interface of Pd-plated Cu Wire Stitch Bonding

摘要

Cu wire is the alternative material to the Au wire in many aspects, such as better electrical and thermal conductivity, higher mechanical strength and its lower cost for the high volume manufacture. Due to the surface oxidation of the Cu wire, the Pd-plated Cu wire (Pd-Cu wire) has been adopted quickly in many fine pitch and high density package devices. Cu wire bonding has been well understood in recent years, while Pd-Cu wire is still under intense investigation. Here we present a study on the interface of the stitch bonding by TEM analysis.