Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd, Guangzhou, Guangdong, P.R. China;
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd, Guangzhou, Guangdong, P.R. China;
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd, Guangzhou, Guangdong, P.R. China;
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd, Guangzhou, Guangdong, P.R. China;
机译:由半导体集成电路封装的粘附拓扑引起的热应力
机译:塑料封装集成电路板中热应力分布的解析解
机译:塑料封装集成电路板中热应力分布的解析解
机译:热应力对高密度封装集成电路的影响
机译:对3D集成电路中通过硅通孔的热应力和可靠性的缩放和微观结构效应
机译:单粒门 - 全围绕单片三维集成电路的低热预算过程的Si纳米线FET
机译:管芯附着空隙对集成电路封装热阻的影响
机译:用于VLsI / VHsIC(超大规模集成电路/超高速集成电路)的高级封装应用:电气,热学和机械方面的考虑 - IR&D报告