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A comparative numerical simulation of a nanoscaled body on Insulator FinFET

机译:绝缘体FinFET上纳米尺度物体的比较数值模拟

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In this paper a FinFET structure with channel region insulated from body by buried oxide(Body Over Insulator) is proposed. Body Over Insulator (BOI) FinFET has advantage over both Silicon Over Insulator(SOI) and Bulk FinFETs. Here, a comparative numerical study of a BOI FinFET, a bulk FinFET and a SOI FinFET is presented. The result have shown that, the proposed BOI FinFET has better short channel effect(SCE) suppression and a lower threshold voltage than bulk FinFET. Better heat dissipation capability by virtue of a smaller insulation, ease of fabrication and acceptable SCE suppression makes this structure a viable competitor of the SOI structure.
机译:本文提出了一种FinFET结构,其沟道区通过掩埋氧化物(Body Over Insulator)与主体绝缘。绝缘体上方(BOI)FinFET优于绝缘体上方硅(SOI)和体FinFET。在此,对BOI FinFET,体FinFET和SOI FinFET进行了比较数值研究。结果表明,所提出的BOI FinFET具有比整体FinFET更好的短沟道效应(SCE)抑制和更低的阈值电压。凭借较小的绝缘,更易于制造和可接受的SCE抑制,更好的散热能力使该结构成为SOI结构的可行竞争对手。

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