Development of fast and easy methods for measuring the Young's modulus of molding compounds for IC packages

摘要

This work presents two different methods that offer a faster, easier and more straightforward data analysis methods for Young's modulus extraction of plastic molding compound materials. Both methods are compared and verified with the nano-indentation (NI) technique. The originality of this study lies in the fact that the evaluation of these methods focuses not only on Young's modulus extraction from bare molding compound material, but also of molding compounds of packaged IC's as well. The results show also that the NI data analysis is not straightforward due to the inhomogeneous mixture of the different types of materials and fillers inside the molding compound, hence resulting in a complex and rather unknown deformation behavior upon indentation.