Physics-of-Failure Research Center, Korea Electronic Technology Institute, Seongnam, 463-816, Republic of Korea;
Physics-of-Failure Research Center, Korea Electronic Technology Institute, Seongnam, 463-816, Republic of Korea;
Physics-of-Failure Research Center, Korea Electronic Technology Institute, Seongnam, 463-816, Republic of Korea;
Physics-of-Failure Research Center, Korea Electronic Technology Institute, Seongnam, 463-816, Republic of Korea;
Physics-of-Failure Research Center, Korea Electronic Technology Institute, Seongnam, 463-816, Republic of Korea;
creep fracture mode; fractography analysis; accelerated life test; SnPb solder joint;
机译:无引线芯片电阻器中焊点的弹性-蠕变分析模型:2014年第2部分; SnPb和无铅焊料的疲劳可靠性预测中的应用
机译:裸铜上共晶SnPb焊点的Kirkendall空隙形成及其对接点可靠性的影响
机译:具有Ag薄膜/ Ge细胞的共晶SNPB焊点中Ag3Sn的固态剥落
机译:SNPB共晶焊接关节故障的蠕变机制Fretcography分析
机译:焊点的蠕变疲劳分析
机译:基于离散空隙形成的倒装芯片焊点失效的电迁移机理
机译:共晶锡铅焊点的超塑性蠕变
机译:共晶pb-sn焊点疲劳机理的观察。