I-Shou University Department of Materials Science and Engineer, No.1, section 1, shiuecheng Rd., Dashu Shiang, Kaohsiung Country, Taiwan, 84008, R.O.C.;
I-Shou University Department of Materials Science and Engineer, No.1, section 1, shiuecheng Rd., Dashu Shiang, Kaohsiung Country, Taiwan, 84008, R.O.C.;
I-Shou University Department of Materials Science and Engineer, No.1, section 1, shiuecheng Rd., Dashu Shiang, Kaohsiung Country, Taiwan, 84008, R.O.C.;
I-Shou University Department of Materials Science and Engineer, No.1, section 1, shiuecheng Rd., Dashu Shiang, Kaohsiung Country, Taiwan, 84008, R.O.C.;
film over wire (FOW); stack-die CSP (Chip Scale Package);
机译:Ag-Sn-Ag多层薄膜和模具附着的半导体应用的背面金属化
机译:薄膜与浆糊:适用于堆叠式裸片应用的裸片附着选项
机译:192Ir导线周围高梯度区域中径向剂量分布的实验确定:电子顺磁共振成像,胶片和蒙特卡洛模拟的比较。
机译:堆叠模具CSP应用中的模具附着膜(爸爸)和薄膜之间的比较
机译:银和金附着的薄膜的表面等离子体激元研究
机译:用于微和纳米电子应用的低k介电薄膜的热稳定性的宽带介电光谱表征
机译:室温下在玻璃基板上超声粘合芯片附着膜(DAF)层压的薄硅芯片
机译:几种厌氧反应器配置中附着膜的比较。总结报告