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Ultrasonic bonding of die attach film (DAF)-laminated thin silicon dies on glass substrates at room temperature

机译：室温下在玻璃基板上超声粘合芯片附着膜（DAF）层压的薄硅芯片

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Department of Electrical Engineering

机译：电机工程系

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Wong SY; Wong HC; Or SW; Cheung YM; Choy PK;
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年度 2008
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正文语种 eng
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专利

1. Room-Temperature Ultrasonic Bonding of Semiconductor Thin-Dies with Die Attach Films on Glass Substrates [J] . Sui Yin Wong, Siii Wing Or, Ho Chi Wong, Japanese journal of applied physics . 2009,第7issue2期

机译：玻璃基板上带有芯片贴装膜的半导体薄模的室温超声键合
2. Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate [J] . S. Keyvaninia, M. Muneeb, S. Stankovi?, Optical Materials Express . 2013,第1期

机译：III-V晶片，裸片和多个裸片的超薄DVS-BCB粘合剂将其粘合到图案化的绝缘体上硅衬底
3. Impact of deposition temperature on the properties of SnS thin films grown over silicon substrate-comparative study of structural and optical properties with films grown on glass substrates [J] . Assili Kawther, Alouani Khaled, Vilanova Xavier Semiconductor science and technology . 2017,第11期

机译：沉积温度对在硅基板上生长的SnS薄膜性能的影响-与在玻璃基板上生长的膜的结构和光学性质的比较研究
4. Ultrasonic Bonding of Die Attach Film (DAF)-Laminated Thin Silicon Dies on Glass Substrates at Room Temperature [C] . Wong Sui Yin, Wong Ho Chi, Or Siu Wing, Electronics Packaging Technology Conference . 2008

机译：模具附着薄膜（DAF）的超声波键合在室温下玻璃基板上的薄硅模具
5. Low temperature photovoltaic devices with quasi-epitaxial silicon thin films on granular silicon substrates. [D] . Farrokh Baroughi, Mahdi. 2006

机译：在粒状硅基板上具有准外延硅薄膜的低温光伏设备。
6. The Glass-Transition Temperature of Supported PMMA Thin Films with Hydrogen Bond/Plasmonic Interface [O] . Jiayao Chen, Jing Li, Lirong Xu, 2019

机译：具有氢键/等离子体界面的负载型PMMA薄膜的玻璃化温度
7. Room-temperature ultrasonic bonding of semiconductor thin-dies with die attach films on glass substrates [O] . Wong SY, Or SW, Wong HC, 2009

机译：在玻璃基板上使用芯片附着膜将半导体薄膜进行室温超声焊接

Ultrasonic bonding of die attach film (DAF)-laminated thin silicon dies on glass substrates at room temperature

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