LASER SPIKE ANNEALING: A NOVEL POST-POROSITY TREATMENT FOR TOUGHENING OF LOW-K ORGANOSILICATES

摘要

In summary, initial results for the laser thermal treatment of organosilicates indicate that with respect to increasing the modulus and minimum sacrifice of the dielectric constant, significant improvements are possible. Of course, this occurs with some shrinkage, particularly in the case of porous materials, typically 10-15 %. Future work will focus on the stresses that may be generated during these high temperature excursions. The use of LSA for post-porosity mechanical enhancement of high porosity, low-k dielectric films offers a viable and attractive alternative to e-beam and UV/thermal methods. With unoptimized fivefold improvements in the modulus and sacrificing only ～ 10% in the dielectric constant, LSA has the potential to outperform current mechanical enhancement methods. Of course, the fact that this approach offers the possibility of spatial addressability, presents opportunities for other potential applications. Additional advantages may present themselves considering that the tool associated with this process is also of great utility for FEOL processes, such as thermal dopant diffusion.