首页> 外文OA文献 >Effect of CH4 Plasma Treatment on O2 Plasma Ashed Organosilicate Low-k Dielectrics

【2h】

Effect of CH4 Plasma Treatment on O2 Plasma Ashed Organosilicate Low-k Dielectrics

机译：CH4等离子体处理对O2等离子体灰化有机硅低k电介质的影响

页面导航

著录项
相似文献
相关主题

著录项

作者
Hualiang Shi; Junjing Bao; Junjun Liu; Huai Huang; Paul S. Ho; Michael D Goodner; Mansour Moinpour; Grant M Kloster;
展开▼
作者单位

展开▼
年度 2015
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Rapid repair of plasma ash damage in low-k dielectrics using supercritical CO2 [J] . Gorman BP, Orozco-Teran RA, Zhang Z, Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures . 2004,第3期

机译：使用超临界CO2快速修复低k电介质中的等离子体灰分损坏
2. Modeling the Dynamics of the Integral Dielectric Permittivity of a Porous Low-K Organosilicate Film during the Dry Etching of a Photoresist in O 2 Plasma [J] . A. A. Rezvanov, I. V. Matyushkin, O. P. Gushchin, Russian Microelectronics . 2018,第6期

机译：在O <下标> 2 等离子体中的光致抗蚀剂的干法蚀刻期间对多孔低钾有机硅酸盐膜的整体介电介电常数的动态。
3. Mechanisms of oxygen plasma damage of amine and methyl terminated organosilicate low-k dielectrics from ab initio molecular dynamics simulations [J] . J M Rimsza, J A Kelber, Jincheng Du Journal of Physics, D. Applied Physics: A Europhysics Journal . 2014,第33期

机译：从头算分子动力学模拟看胺和甲基封端的有机硅低k电介质对氧等离子体的破坏机理
4. Effect of CH4 Plasma Treatment on O2 Plasma Ashed Organosilicate Low-k Dielectrics [C] . Hualiang Shi, Junjing Bao, Junjun liu, MRS spring meeting . 2007

机译：CH4等离子体处理对O2等离子体灰化有机硅低k介电常数的影响
5. Mechanical reliability of porous low-k dielectrics for advanced interconnect: Study of the instability mechanisms in porous low-k dielectrics and their mediation through inert plasma induced re-polymerization of the backbone structure. [D] . Sa, Yoonki. 2015

机译：用于高级互连的多孔低k电介质的机械可靠性：多孔低k电介质的不稳定性机理及其通过惰性等离子体引发的骨架结构再聚合的介导研究。
6. Electrical Performance and Reliability Improvement of Amorphous-Indium-Gallium-Zinc-Oxide Thin-Film Transistors with HfO2 Gate Dielectrics by CF4 Plasma Treatment [O] . Ching-Lin Fan, Fan-Ping Tseng, Chiao-Yuan Tseng 2018

机译：CF4等离子体处理HfO2栅电介质的非晶铟镓锌氧化物薄膜晶体管的电性能和可靠性提高
7. Dielectric Recovery of Plasma Damaged Organosilicate Low-k Films [O] . Hualiang Shi, Junjing Bao, Huai Huang, 2015

机译：等离子体损伤有机硅酸盐低k薄膜的介电恢复

Effect of CH4 Plasma Treatment on O2 Plasma Ashed Organosilicate Low-k Dielectrics

著录项

相似文献

相关主题

期刊订阅