Searching for BTA Alternatives for Metal CMP

摘要

One of the key challenges faced by the Copper Chemical Mechanical Polishing (Cu-CMP) community is how to conduct the operation under low down force with high throughput at desired pH. In general, the optimal pH for copper CMP slurry reflects the collective characteristics of all chemical additives such as oxidizer, complexing agent, passivating agent, and surfactant. Among them, the physical and chemical behavior of the passivating agent in the pH region plays a pivotal role. Although tremendous efforts have been devoted to the understanding of the roles of various slurry components for copper CMP [1-3], there has been limited systematic study on the sensitivity of passivating agent towards pH and the selection criteria for a suitable passivating agent for a particular pH .