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Study on the Reliability of Capacitive Shunt RF MEMS Switch

机译:电容并联RF MEMS开关的可靠性研究

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Study on the reliability of capacitive shunt RF MEMS switch is present. The electrical failure and mechanical failure mechanism is analyzed separately. In the electrical failure analysis', the breakdown of dielectric between up- and down-electrode is measured and analyzed. In the measurement, a ramping DC voltage of 5Vs~(-1) is applied and different breakdown voltages are obtained. For the switches with electrode roughness of 27.4nm, 16.0nm and 5.4nm, the breakdown event maximum is in the voltage ranges of 20~40V, 30~60V and 80~110V respectively. In the mechanical failure analysis, the failure induced by stress is analysis. The failure samples of A1 membrane broken and buckling are present. The best stress in Al membrane is at the range of 10~20MPa.
机译:目前对电容并联RF MEMS开关的可靠性进行了研究。分别对电气故障和机械故障机理进行了分析。在“电气故障分析”中,对上下电极之间的电介质击穿进行了测量和分析。在测量中,施加5Vs〜(-1)的倾斜直流电压,并获得不同的击穿电压。对于电极粗糙度为27.4nm,16.0nm和5.4nm的开关,击穿事件最大值分别在20〜40V,30〜60V和80〜110V的电压范围内。在机械失效分析中,应力引起的失效被分析。存在A1膜破裂和屈曲的失效样本。铝膜的最佳应力为10〜20MPa。

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