Simulation and Testing of Multi-channel Electron Multiplier Using LTCC/Thick Silver Cofired Structures

摘要

A novel multi-channel electron multiplier for high power applications has been developed in LTCC technology. The dynode structure has been fabricated using alternating layers of cofired LTCC and thick (.2-.6 mm) Ag layers. The secondary electron emitter (SEE) material is sol gel processed nano-size (20 nm) MgO, which has been applied to the interior wall of the channel and fired to obtain the highest SEE emission. Micro (25-50 microns) cooling channels are fabricated into the thick Ag layer, allowing the Ag layer to provide both conduction and convective cooling. Resistors are integrated into the structure to provide the impedance drop between the applied voltage and each dynode plate. Monte Carlo simulation has been performed for box and grid and chevron-shaped structures. For a two dynode multiplier we have measured an electron multiplication factor of 1.6, although a bias is observed between the measurement and the simulation method.