HIGH CYCLE VIBRATION TESTING OF BGA PACKAGES

摘要

The objective of this work is to develop an experimental apparatus, which will facilitate visual monitoring of the solder joint interconnects in a plastic ball grid array (PBGA) package during cyclic testing. The apparatus has been used to determine crack initiation, crack propagation speed, and joint failure. The experiments are complemented by nonlinear finite element modeling and static strain measurements using moire interferometry. A representative test is described and the result compared to two model descriptions found in the literature.