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BGA PACKAGE SUBSTRATE AND TEST IT USING BGA PACKAGE TESTING METHODS
BGA PACKAGE SUBSTRATE AND TEST IT USING BGA PACKAGE TESTING METHODS
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机译:使用BGA封装测试方法对BGA封装基质进行测试
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摘要
PURPOSE: A substrate for a BGA(Ball Grid Array) package test and a BGA package testing method using the same are provided to smoothly test a degradation rate of a BGA package. CONSTITUTION: A substrate(100) is installed between a connection socket(20) and a BGA package(30) to test the BGA package. The substrate is used for testing the defective rate of the BGA package through a surface contact between a connection terminal(22) of the connection socket and a ball type connection terminal(32) of the BGA package.
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