Bumpless Build-Up Layer Packaging

摘要

Bumpless Build-Up Layer (BBUL) is a novel package developed to meet future packaging technology requirements. The BBUL package provides the advantages of small electrical loop inductance and reduced thermomechan-ical stresses on low dielectric constant (low-k) die materials. Furthermore, it allows for high lead count, ready integration of multiple electronic and optical components [such as logic, memory, radio frequency, microelectromechanical systems (MEMS), among others], and inherent scalability. In the present paper we investigate and discuss some of the process, routing, electrical, thermal, and mechanical attributes of BBUL.