Modeling of Thermal Stress Build-up During Processing of Multi-layer Micro-dynamical Systems

摘要

The present investigation is devoted to the finite element modeling of stress buildup during processing of multi-layered microdynamical devices. Modeling is performed with the commercial software package Mark-Mentat. Mechanical properties of materials during modeling are assumed to be elastic. In the current modeling, only the final composite structure is considered. However, to imitate the thermal cycling that occurs during deposition or etching of layers, elastic time-dependent material parameters are used. Development of this model gives a means to predict the distortion of multi- layered devices due to residual stresses.