首页> 外文会议>2000 2~nd International Conference on Microwave and Millimeter Wave Technology September 14-16, 2000, Beijing, China >A Comparative Study of Reliability of GaAs MESFETs With TiAl and TiPtAu Gate at Elevated Temperature and High Current Density
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A Comparative Study of Reliability of GaAs MESFETs With TiAl and TiPtAu Gate at Elevated Temperature and High Current Density

机译:TiAl和TiPtAu栅在高温高电流密度下GaAs MESFET可靠性的比较研究

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摘要

A comparative study of performance degradation of GaSs MESFETs with TiAl and TiPtAu gate at elevated temperature and high current density is pressented. Results show that (1) the increase in gate series resistance R_g is a main factor that leads to increase in ideality factor n of TiAl and TiPtAu gates Schottky diodes. (2) the TiAl gate Schottdy diode performance (gate series resistance R_g, ideality factor n, barrier height PHE_b) remains stable whereas the device parameters such as maximum performance (ideality factor n, barrier height PHE_b) remains stable whereas the device parameters such as maximum drain saturation current I_dss, open channel resistance below the gate R_o, pinch-off voltage V_po, the transconductance g_m etc. degrade rapidly. The performance degradation of the two types of MESFETS forms a sharp contrast.
机译:迫切需要对在高温和高电流密度下具有TiAl和TiPtAu栅极的GaSs MESFET的性能下降进行比较研究。结果表明:(1)栅极串联电阻R_g的增加是导致TiAl和TiPtAu栅极肖特基二极管的理想因子n增加的主要因素。 (2)TiAl栅极肖特基二极管的性能(栅极串联电阻R_g,理想因子n,势垒高度PHE_b)保持稳定,而器件参数(例如最大性能)(理想因子n,势垒高度PHE_b)保持稳定,而器件参数例如最大漏极饱和电流I_dss,栅极R_o以下的开路电阻,夹断电压V_po,跨导g_m等迅速降低。两种类型的MESFET的性能下降形成了鲜明的对比。

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