机译:具有GeMoW欧姆接触的GaAs MESFET上的Al和TiPtAu金属化的比较
Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright Patterson AFB, OH, USA;
III-V semiconductors; Schottky gate field effect transistors; aluminium; gallium arsenide; germanium alloys; gold alloys; metallisation; molybdenum alloys; ohmic contacts; platinum alloys; semiconductor-metal boundaries; titanium alloys; tungsten alloys; 500 degC; Al metallisation; Al-GeMoW-GaAs; GaAs MESFET; GeMoW ohmic contacts; I-V characteristics; Ti-Pt-Au alloy metallisation; TiPtAu-GeMoW-GaAs; drain contact; gate metal; interconnect metal; source contact; thermal cycling; thermal stressing;
机译:GeMoW难熔欧姆接触与In / sub 0.5 / Ga / sub 0.5 / As覆盖层的n型GaAs
机译:GaAs MESFET的非合金Pd / Sn和Pd / Sn / Au欧姆接触:技术和性能
机译:具有非合金欧姆接触的GaAs MESFET:技术和性能
机译:使用GeMoW金属化技术对n型GaAs进行欧姆接触以进行自我处理
机译:通过固相反应开发与n-Ga(或Al)(0.5)In(0.5)P的不尖峰欧姆接触以及对n-GaAs进行低温处理的欧姆接触
机译:掺Si的双面非合金欧姆接触等离子体电子器件的砷化镓
机译:用于制造GaAs MESFET的新型非合金热稳定Pd / Sn和Pd / Sn / Au欧姆接触