首页> 外国专利> Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers

Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers

机译:通过控制N-GaAs多晶层的生长N-GaAs与导电衬底的欧姆接触

摘要

Thin layers of polycrystalline n-type GaAs have been deposited on a conducting substrate such as graphite. These contacted GaAs layers exhibit desirable properties for device applications, i.e., adequate cohesion between the GaAs and the substrate, good electrical contact to the conducting substrate, and good nucleation of the GaAs on the substrate yielding pinhole free or near pinhole free GaAs layers composed of large grains. These properties are obtained by first depositing a very thin coating, a coating with a nominal thickness between 1000 A and 250 A, of a Group IV element, Ge, Si, or Sn, onto the conducting substrate and then depositing the GaAs over this thin layer.
机译:多晶n型GaAs薄层已沉积在导电衬底(例如石墨)上。这些接触的GaAs层具有器件应用所需的特性,即GaAs与衬底之间的足够的内聚力,与导电衬底的良好电接触以及GaAs在衬底上的良好成核作用,从而产生了无针孔或几乎无针孔的GaAs层,由大颗粒。通过首先在导电基板上沉积非常薄的第四族元素Ge,Si或Sn的极薄涂层(标称厚度在1000 A至250 A之间的涂层),然后在该薄层上沉积GaAs来获得这些性能。层。

著录项

  • 公开/公告号US4213801A

    专利类型

  • 公开/公告日1980-07-22

    原文格式PDF

  • 申请/专利权人 BELL TELEPHONE LABORATORIES INC;

    申请/专利号US19790023697

  • 发明设计人 WILBUR D. JOHNSTON JR.;

    申请日1979-03-26

  • 分类号H01L23/48;H01L29/46;

  • 国家 US

  • 入库时间 2022-08-22 17:03:04

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