【24h】

Visual Modeling and Design of Microelectromechanical System (MEMS) Transducers

机译:微机电系统(MEMS)传感器的可视化建模和设计

获取原文
获取原文并翻译 | 示例

摘要

Microelectromechanical systems (MEMS) integrates miniaturized mechanical structures with electronics to extend the benefits of planar integrated circuit technology to a broader class of systems. To realize the potential and growth of MEMS, new modeling, analysis, and design techniques are required to address both mechanics and electronics. The close proximity of the integration of mechanical and electrical domains within the small dimensions associated with very large scale integration (VLSI) presents new energy-coupling issues. The behavior of the overall system is not the simple concatenation of separate mechanical and electrical behaviors, but the simultaneous combination of mechanical and electrical behaviors. In this paper, we address initial design capture and system conceptualization of microelectromechanical system transducers based on visual modeling and design. We present the concepts of structured topological design, circuit-level branch constitutive differential and algebraic equations (DAEs) characterization, and design-by-direct-manipulation.
机译:微机电系统(MEMS)将小型机械结构与电子设备集成在一起,以将平面集成电路技术的优势扩展到更广泛的系统类别。为了实现MEMS的潜力和增长,需要新的建模,分析和设计技术来解决机械和电子方面的问题。在与超大规模集成(VLSI)相关的小尺寸范围内,机械域和电气域的集成非常接近,这带来了新的能量耦合问题。整个系统的行为不是简单的机械和电气行为的简单串联,而是机械和电气行为的同时结合。在本文中,我们解决了基于视觉建模和设计的微机电系统换能器的初始设计捕获和系统概念化问题。我们介绍了结构化拓扑设计,电路级分支本构微分和代数方程(DAE)表征以及按直接设计进行设计的概念。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号