Z-AXIS ADHESIVE FILM INTERCONNECT USING 150 MICRON 75 MICRON PITCH FLEX CIRCUITS

摘要

High reliability interconnection processes have become increasingly important with flex circuit pitch continually decreasing. Z-axis Adhesive Film (ZAF) is an anisotropic adhesive commonly used in flat panel display (FPD) assemblies. This paper describes a ZAF application at 150 and 75 micron pitch for flex interconnect. A few of the reasons why the ZAF process is considered ideal for this flex interconnect are: 1) fine pitch capability 2) no flux, CFCs or lead 3) improved joint elasticity.rnThe ZAF process described has produced a highly reliable interconnect with a lower bond resistance than conventional SnPb solder reflow.