SnPb, Pb-FREE, AND BACKWARD COMPATIBLE SOLDERING PROCESSES OF HIGH-SPEED BGA CONNECTORS

摘要

Current Giga-bit switches, router systems, and other high speed equipment typically contain various right angle o parallel sub-modules which increase functionality and / o features within the system. These interconnects between the main board and sub-modules are required to provide a reliable high-speed interface for up to 20 years of produc life. Data rate, signal density, and manufacturability are now driving designs to incorporate a ball-grid array (BGA form factor to meet customer’s demands. Many area array connectors in the market today have the necessary speed and area density; however, most offer challenges in the area o manufacturing during SMT, rework, inspection, and have potential reliability issues during the product service life.